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#turkiye153 stories
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Technology

Dijitaliyidir2 September 2026

TSMC’nin Kapasitesi Dolunca MediaTek, Broadcom ve Meta Intel’in Çip Paketlemesine Yöneldi

Yapay zeka çiplerine olan talep TSMC'nin CoWoS hatlarını tamamen doldurunca MediaTek, Broadcom ve Meta gözünü Intel'in EMIB-T paketleme teknolojisine çevirdi. Google ve Nvidia da teknolojiye ilgi gösterirken SK Hynix bile Intel'le yeni bir iş birliğine imza attı.

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